STMicroelectronics recommends a PCB layout with a large copper area connected to the tab of the device to improve thermal dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to ensure good heat sinking.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device. Additionally, ensure good thermal design, use a heat sink if necessary, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
STMicroelectronics recommends using a gate drive circuit with a resistance of 10-20 ohms and a capacitance of 1-10 nF to ensure proper switching performance. The gate drive voltage should be between 10-15V, and the gate current should be limited to 1-2A.
To protect the TYN616 from overvoltage and overcurrent conditions, use a voltage clamp or a transient voltage suppressor (TVS) to limit the voltage across the device. Additionally, use a current sense resistor and a fuse or a current limiter to prevent overcurrent conditions.
STMicroelectronics recommends using a snubber circuit with a resistance of 10-20 ohms and a capacitance of 10-100 nF to reduce electromagnetic interference (EMI) and voltage spikes during switching. The snubber circuit should be connected between the drain and source terminals of the device.
