A good PCB layout is crucial for optimal performance. TI recommends a 4-layer PCB with a solid ground plane, and to keep the high-speed signals away from the power planes. Also, use a common mode filter and a shielded cable to minimize EMI.
To ensure signal integrity, use a 90-ohm differential impedance for the USB traces, and keep the traces as short as possible. Also, use a common mode filter and a shielded cable to minimize EMI. Additionally, use a signal integrity analysis tool to simulate and optimize the design.
The TUSB8041ARGCT supports cable lengths up to 3 meters, but this can vary depending on the specific application and the quality of the cable. It's recommended to use a high-quality, shielded cable to minimize signal degradation.
The TUSB8041ARGCT has a built-in power management feature that allows it to enter a low-power state when not in use. To implement power management, use the device's power-down mode and configure the power management registers according to the application's requirements.
The TUSB8041ARGCT has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device within the recommended operating temperature range, and use a heat sink or thermal pad if necessary. Also, ensure good airflow and avoid blocking the airflow around the device.
TUSB8041ARGCT datasheet
by Texas Instruments
