STMicroelectronics provides a recommended PCB layout in the application note AN4553, which includes guidelines for component placement, routing, and thermal management.
The TSM103AID requires a stable power supply with adequate decoupling capacitors. A 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel are recommended for decoupling. Additionally, a 100nF capacitor is recommended for filtering.
The TSM103AID is rated for operation from -40°C to 150°C, but the maximum operating temperature range depends on the specific application and thermal management. Consult the datasheet and application notes for more information.
The TSM103AID can be programmed using the STMicroelectronics Serial Peripheral Interface (SPI) or Inter-Integrated Circuit (I2C) interface. Consult the datasheet and application notes for programming guidelines and software development kits (SDKs).
The TSM103AID has a high power density, so thermal management is critical. Ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider heat sinks or thermal interfaces for high-power applications.
TSM103AID datasheet
by STMicroelectronics
