STMicroelectronics provides a recommended PCB layout in the application note AN4553, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
The TSM1013AID requires a stable power supply with adequate decoupling capacitors. A minimum of 10uF ceramic capacitor and 1uF film capacitor in parallel is recommended for each power pin, placed as close as possible to the device. Additionally, a 100nF capacitor is recommended between the VCC and GND pins.
The maximum allowed voltage on the input pins of the TSM1013AID is VCC + 0.3V, which is 5.3V for a 5V supply. Exceeding this voltage may damage the device.
The TSM1013AID has a thermal pad that must be connected to a thermal ground plane on the PCB to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve thermal conductivity. The device's junction temperature should be kept below 150°C to ensure reliable operation.
The recommended clock frequency for the TSM1013AID is between 10kHz and 100kHz. Operating the device at frequencies outside this range may affect its performance and accuracy.
TSM1013AID datasheet
by STMicroelectronics
