TSM1011AIDT datasheet by STMicroelectronics

TSM1011AIDT Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended for optimal thermal performance. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
• How do I ensure reliable operation at high temperatures?
  Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power dissipation at high temperatures.
• What is the recommended input capacitor value and type for the TSM1011AIDT?
  A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
• How do I minimize electromagnetic interference (EMI) in my design?
  Use a shielded inductor, keep the layout compact, and minimize loop areas. Also, consider adding a common-mode choke and a filter capacitor to reduce EMI emissions.
• What is the recommended output capacitor value and type for the TSM1011AIDT?
  A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.