STMicroelectronics recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the IC to ensure optimal thermal performance.
To ensure EMC, use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Additionally, follow the recommended layout guidelines and use a low-pass filter on the output.
The maximum allowed voltage drop across the internal voltage regulator is 2.5V. Exceeding this value may affect the device's reliability and performance.
While the TS974IYPT is rated for operation up to 150°C, it's essential to consider the device's power dissipation and thermal management. Ensure proper heat sinking and thermal design to prevent overheating and ensure reliable operation.
To troubleshoot issues, check the input voltage, output load, and PCB layout. Verify that the device is properly soldered and that the thermal pad is connected to a solid ground plane. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for guidance.