STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Implement thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the junction temperature below 150°C. Also, ensure proper PCB design and layout to minimize thermal resistance.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling, placed as close to the TS971ILT as possible to minimize noise and ensure stable operation.
Use a shielded enclosure, keep the TS971ILT away from noise sources, and use a common-mode choke or ferrite bead on the input lines to reduce EMI. Also, ensure good PCB layout practices, such as separating analog and digital grounds.
The enable pin (EN) should not exceed 6V to ensure reliable operation and prevent damage to the device.