STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The TS971IDT has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
The TS971IDT is rated for operation from -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C to ensure reliability and prevent damage.
The TS971IDT has several configuration options, including input voltage range, output voltage, and current limit. These can be set using external resistors and capacitors, or through the use of a dedicated configuration IC, such as the STMicroelectronics STEVAL-ISA176V1 evaluation board.
The typical efficiency of the TS971IDT is around 95% at full load, depending on the input voltage, output voltage, and operating frequency. Efficiency can be optimized by selecting the appropriate external components and operating conditions.
TS971IDT datasheet
by STMicroelectronics
