The recommended land pattern for the TS53YL202MR10 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
The TS53YL202MR10 has a thermal resistance of 35°C/W. To handle thermal management, ensure good airflow, use a heat sink if necessary, and follow proper PCB design guidelines for thermal dissipation.
The maximum operating temperature range for the TS53YL202MR10 is -55°C to 150°C.
Yes, the TS53YL202MR10 is suitable for high-reliability applications due to its high-quality construction and rigorous testing. However, it's essential to follow proper design and manufacturing guidelines to ensure reliability.
To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid overheating the component.
