The recommended land pattern for the TS53YL102MR10 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and follow the recommended PCB layout guidelines to minimize thermal resistance.
The maximum operating temperature range for the TS53YL102MR10 is -55°C to +125°C, with a storage temperature range of -55°C to +150°C.
To ensure reliability, follow the recommended derating guidelines, use a robust PCB design, and implement adequate thermal management and ESD protection measures.
The TS53YL102MR10 has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). Ensure proper ESD handling and protection during assembly and operation.
