The recommended PCB footprint for the TS53YJ502MR10 is a rectangle with dimensions of 5.3mm x 3.3mm, with a pad size of 2.5mm x 2.5mm and a pitch of 1.27mm.
To handle thermal management, ensure good airflow around the component, use a thermal pad or heat sink if necessary, and follow the recommended PCB layout and thermal design guidelines.
The maximum operating temperature range for the TS53YJ502MR10 is -40°C to +125°C, with a storage temperature range of -40°C to +150°C.
Yes, the TS53YJ502MR10 is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, meeting the requirements for lead-free and halogen-free materials.
The recommended soldering profile for the TS53YJ502MR10 is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a preheat temperature of 150-200°C.
