The recommended land pattern for the TS53YJ202MR10 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
The TS53YJ202MR10 has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or thermal interface material, and provide adequate airflow around the component.
The maximum operating temperature range for the TS53YJ202MR10 is -55°C to 150°C.
Yes, the TS53YJ202MR10 is suitable for high-reliability applications due to its high-quality construction and rigorous testing. However, it's essential to follow proper design and manufacturing guidelines to ensure the component's reliability.
To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the component leads. Use a solder with a melting point of 180°C to 190°C, and avoid overheating the component.
