STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal grease or thermal tape, to improve heat transfer between the device and the heat sink or PCB.
While the TS4994EIJT has internal ESD protection, it's not designed to withstand repeated or high-energy ESD events. External ESD protection devices may be necessary to ensure robustness in harsh environments. It's also important to follow proper handling and assembly procedures to prevent ESD damage during manufacturing.
Yes, the TS4994EIJT is suitable for high-reliability and automotive applications. STMicroelectronics provides a dedicated automotive-grade version, the TS4994EIJT-Q, which meets the AEC-Q100 standard. However, it's essential to consult with STMicroelectronics and follow their guidelines for using the device in these applications.
To troubleshoot POR-related issues, verify that the power supply voltage is within the recommended range and that the power-up sequence is correct. Also, check for any noise or glitches on the power supply lines, as these can affect the POR circuitry. If issues persist, consult the STMicroelectronics application notes and technical support resources for further guidance.
TS4994EIJT datasheet
by STMicroelectronics
Findchips
