STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure efficient heat dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal management guidelines, including proper heat sinking, and ensuring the device operates within the specified junction temperature range (TJ) of -40°C to 150°C.
STMicroelectronics recommends following the IEC 61000-4-2 standard for ESD protection, which includes using ESD protection devices, such as TVS diodes, and following proper PCB design and layout guidelines to minimize ESD susceptibility.
Yes, the TS4040DILT-2.5 is suitable for high-reliability and automotive applications, as it meets the requirements of the AEC-Q100 standard for automotive-grade devices. However, it's essential to follow the recommended design and qualification guidelines for these applications.
STMicroelectronics recommends following the JEDEC J-STD-020 standard for soldering and assembly, which includes guidelines for reflow soldering, wave soldering, and manual soldering to ensure reliable assembly and minimize the risk of damage during the assembly process.
TS4040DILT-2.5 datasheet
by STMicroelectronics
