TS3USB3200RSVR datasheet by Texas Instruments

TS3USB3200RSVR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the TS3USB3200RSVR to minimize signal integrity issues?
  Texas Instruments provides a recommended PCB layout in the application note SLLA319, which includes guidelines for signal routing, grounding, and decoupling to ensure optimal performance.
• How do I configure the TS3USB3200RSVR for USB 3.0 SuperSpeed operation?
  The TS3USB3200RSVR is configured for USB 3.0 SuperSpeed operation by setting the MODE pin high and the SPEED pin low. Additionally, the device must be powered from a 1.8V or 3.3V supply, and the VBUS pin must be connected to the USB bus voltage.
• What is the maximum cable length supported by the TS3USB3200RSVR?
  The TS3USB3200RSVR supports cable lengths up to 3 meters, but the actual maximum length may vary depending on the specific application and signal quality requirements.
• How do I implement power management for the TS3USB3200RSVR?
  The TS3USB3200RSVR has a built-in power management feature that can be controlled through the EN pin. The device can be powered down by pulling the EN pin low, and powered up by pulling it high.
• What are the thermal management considerations for the TS3USB3200RSVR?
  The TS3USB3200RSVR has a maximum junction temperature of 125°C. To ensure reliable operation, the device should be mounted on a PCB with adequate thermal dissipation, and the ambient temperature should be kept below 85°C.