TS3USB221RSERG4 datasheet by Texas Instruments

TS3USB221RSERG4 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the TS3USB221RSERG4 to minimize signal integrity issues?
  Texas Instruments provides a recommended PCB layout in the application note SLVA883, which includes guidelines for signal routing, grounding, and decoupling to ensure optimal performance.
• How do I configure the TS3USB221RSERG4 for USB 3.2 Gen 2 operation?
  The TS3USB221RSERG4 is a USB 3.2 Gen 2 capable device. To configure it for Gen 2 operation, set the MODE pin to logic high and ensure the input clock frequency is 100 MHz. Refer to the datasheet for specific register settings and configuration details.
• What is the maximum cable length supported by the TS3USB221RSERG4?
  The TS3USB221RSERG4 supports cable lengths up to 3 meters for USB 3.2 Gen 2 operation, assuming a good quality cable with minimal signal attenuation. However, the actual cable length may vary depending on the specific application and cable characteristics.
• How do I implement power management for the TS3USB221RSERG4?
  The TS3USB221RSERG4 has a built-in power management feature that can be controlled through the Power Management (PM) pins. By asserting the PM pins, the device can be put into a low-power state, reducing power consumption. Refer to the datasheet for specific pin configurations and power management modes.
• What are the thermal management considerations for the TS3USB221RSERG4?
  The TS3USB221RSERG4 has a maximum junction temperature of 150°C. To ensure reliable operation, it is essential to provide adequate thermal management, such as heat sinks, thermal pads, or thermal interfaces, to keep the device temperature within the recommended operating range.