Texas Instruments provides a recommended PCB layout and routing guide in their application notes (e.g., SLVAE25) and design guides (e.g., TIDA-00726). It's essential to follow these guidelines to ensure signal integrity and minimize signal degradation.
The TS3DDR3812RUAR requires a specific power sequencing and voltage ramp-up procedure to ensure proper operation. Refer to the datasheet and application notes (e.g., SLVAE25) for detailed guidelines on power-up and power-down sequences.
The TS3DDR3812RUAR has a maximum junction temperature (TJ) of 150°C. Ensure proper thermal management by providing adequate heat sinking, airflow, and thermal interface materials to maintain a safe operating temperature.
Use Texas Instruments' debugging tools, such as the TI Logic Analyzer or the TI Development Kit, to troubleshoot and debug issues. Additionally, consult the datasheet, application notes, and online resources (e.g., TI E2E forums) for guidance on troubleshooting common issues.
The TS3DDR3812RUAR is designed to meet EMI and RFI standards. However, it's essential to follow proper PCB design and layout practices, such as using shielding, grounding, and filtering, to minimize EMI and RFI emissions.
TS3DDR3812RUAR datasheet
by Texas Instruments
