STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The TS372CD has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
The TS372CD is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability and prevent thermal runaway.
The TS372CD is sensitive to ESD, so it's essential to handle the device with ESD-safe materials and follow proper ESD handling procedures. A human body model (HBM) ESD protection diode can be added to the input pins to protect the device from ESD events.
The recommended input capacitor value for the TS372CD is 1-10 μF, depending on the input voltage and output current requirements. A larger input capacitor can help to reduce input voltage ripple and improve output voltage regulation.
TS372CD datasheet
by STMicroelectronics
