STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The TS3702CD has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and avoid blocking the airflow with nearby components.
The TS3702CD is rated for operation from -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Ensure that the device is operated within the recommended temperature range to prevent damage or degradation.
Handle the TS3702CD with care to prevent ESD damage. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded. Avoid touching the device pins or handling the device in a way that could generate static electricity.
The recommended input capacitance for the TS3702CD is 10nF to 100nF, depending on the specific application and noise requirements. A larger input capacitance can help filter out noise and improve stability, but may also increase the startup time.
TS3702CD datasheet
by STMicroelectronics
