A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure the thermal pad is connected to a large copper area to dissipate heat efficiently.
Monitor the junction temperature (TJ) and ensure it stays within the recommended range (-40°C to 150°C). Also, maintain the input voltage within the specified range (1.65V to 5.5V) and ensure the output current does not exceed the maximum rating (1A).
A 1-10uF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
Use a 1-10uF ceramic capacitor (X5R or X7R dielectric) for output filtering. Additionally, ensure the output capacitor is placed close to the VOUT pin and the PCB layout is designed to minimize loop inductance.
The EN pin should be connected to a logic-level signal (e.g., from a microcontroller) or tied to VIN through a resistor (e.g., 1kΩ) if not used. Ensure the EN pin is not left floating.
TS321IDBVRE4 datasheet
by Texas Instruments
