STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within the recommended temperature range.
Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, regardless of the supply voltage (VCC). Exceeding this voltage may cause damage to the device.
STMicroelectronics recommends implementing ESD protection measures, such as using ESD diodes or transient voltage suppressors (TVS) on the input lines, to prevent damage from electrostatic discharge. Additionally, follow proper handling and storage procedures to minimize the risk of ESD damage.
To ensure proper operation, it's recommended to power up the device in the following sequence: VCC, then input signals. This sequence helps prevent latch-up and ensures that the device operates correctly.
TS27M2CN datasheet
by STMicroelectronics
Findchips
Findchips