STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using thermal management techniques, such as heat sinks or fans, to keep the device temperature within the recommended range.
The TS27L2CD is not hermetically sealed, so it's essential to take precautions when operating in high-humidity environments. Consider using conformal coating or potting to protect the device from moisture. Additionally, ensure the PCB is designed with moisture-resistant materials and follow proper assembly and handling procedures.
The TS27L2CD is not specifically designed for radiation-intensive environments. If you need to operate in such an environment, consider using radiation-hardened devices or consult with STMicroelectronics for customized solutions.
STMicroelectronics recommends following standard ESD protection procedures, including using ESD-sensitive handling and storage techniques. Additionally, consider using ESD protection devices, such as TVS diodes, on the input and output pins to protect the device from electrostatic discharge.
TS27L2CD datasheet
by STMicroelectronics
