STMicroelectronics recommends a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Always operate the device within the recommended temperature range and avoid overheating.
Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically limited to the supply voltage (VCC) + 0.3V to prevent damage to the internal ESD protection diodes.
To prevent ESD damage, handle the TS1874AIYDT with an anti-static wrist strap or mat, and ensure that the PCB is properly grounded during assembly. Avoid touching the device pins or handling the device in environments with high electrostatic charges.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a reflow soldering process, and the soldering time should be minimized to prevent thermal damage.
TS1874AIYDT datasheet
by STMicroelectronics
