STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
STMicroelectronics recommends soldering the TS1220-600B-TR using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds.
To ensure ESD protection, handle the TS1220-600B-TR with ESD-safe materials, use an ESD wrist strap or mat, and follow proper handling and storage procedures to prevent electrostatic discharge damage.
Store the TS1220-600B-TR in a dry, cool place, away from direct sunlight and moisture, with a temperature range of -40°C to 125°C (-40°F to 257°F) and relative humidity below 60%.
TS1220-600B-TR datasheet
by STMicroelectronics
