Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The TRS202ECD has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, the application note SLVAE04 provides guidelines for thermal management, including thermal pad connection and heat sink design.
The TRS202ECD has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for temperatures above 125°C to ensure reliability.
To ensure EMC, follow the guidelines in the application note SLVAE04, which includes recommendations for PCB layout, component selection, and shielding. Additionally, the TRS202ECD has built-in electromagnetic interference (EMI) filters, but external filtering may still be required depending on the application.
The recommended input capacitor value depends on the input voltage and frequency. A general guideline is to use a capacitor with a value of 10uF to 22uF, with a voltage rating of at least 1.5 times the input voltage. The application note SLVAE04 provides more detailed guidance on input capacitor selection.