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    Part Img TPS659109A1RSL datasheet by Texas Instruments

    • TPS659109A1 - Integrated Power Management IC w/ 4 DC/DCs, 8 LDOs and RTC in 6x6mm QFN 48-VQFN -40 to 85
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    TPS659109A1RSL datasheet preview

    TPS659109A1RSL Frequently Asked Questions (FAQs)

    • Texas Instruments provides a recommended PCB layout in the TPS659109A1RSL evaluation module (EVM) user's guide, which can be found on the TI website. The EVM user's guide includes a detailed layout guide, including Gerber files and PCB design files.
    • The TPS659109A1RSL has a flexible power sequencing scheme, and the optimal sequence depends on the specific application. TI provides a Power Sequencing Tool on their website, which can help engineers optimize the power sequencing for their design. Additionally, TI's application notes and technical articles provide guidance on power sequencing for various applications.
    • The maximum current capability of the TPS659109A1RSL depends on the specific output rail and the thermal design of the PCB. The datasheet provides maximum current ratings for each output rail, but engineers should also consider the thermal performance of the device and the PCB to ensure reliable operation. TI provides thermal design guidelines and simulation tools to help engineers estimate the maximum current capability for their specific design.
    • TI provides a troubleshooting guide for the TPS659109A1RSL, which can be found in the device's datasheet or on the TI website. The guide provides a step-by-step approach to troubleshooting common issues, including power-up sequencing, voltage regulation, and fault detection. Additionally, TI's technical support team is available to provide assistance with troubleshooting and design issues.
    • The TPS659109A1RSL is rated for operation up to 105°C, but engineers should consider the thermal performance of the device and the PCB to ensure reliable operation in high-temperature environments. TI provides thermal design guidelines and simulation tools to help engineers estimate the device's performance in high-temperature environments. Additionally, engineers should consider the reliability and lifetime of the device in high-temperature environments.
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