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    Part Img TPS62087RLTT datasheet by Texas Instruments

    • TPS62087 - 3-A Step-Down Converter with DCS-Control and Hiccup Short Circuit Protection in 2x2 QFN Package 7-VQFN -40 to 85
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    TPS62087RLTT datasheet preview

    TPS62087RLTT Frequently Asked Questions (FAQs)

    • A good PCB layout for the TPS62087RLTT involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a separate power plane for the input voltage and to keep the noise-sensitive analog traces away from the switching node.
    • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output capacitor should be selected based on the output voltage and current requirements, and the input capacitor should be chosen based on the input voltage and current ripple requirements. It's also important to ensure that the feedback resistors are properly selected to maintain a stable loop gain.
    • The TPS62087RLTT is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the thermal design of the system. It's essential to ensure that the device is operated within its recommended operating temperature range to ensure reliability and performance.
    • The output voltage ripple of the TPS62087RLTT can be calculated using the following formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ΔVout is the output voltage ripple, Iout is the output current, ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
    • The recommended input capacitor type for the TPS62087RLTT is a low-ESR ceramic capacitor with a value of 10 μF to 22 μF. The input capacitor should be selected based on the input voltage and current ripple requirements, as well as the PCB layout and thermal considerations.
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