A good PCB layout for the TPS3836L30QDBVRQ1 involves placing the device close to the power source, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
When choosing bypass capacitors for the TPS3836L30QDBVRQ1, consider the capacitor's voltage rating, capacitance value, and equivalent series resistance (ESR). A good starting point is to use a 10uF ceramic capacitor with a voltage rating of 10V or higher and an ESR of less than 100mΩ.
The TPS3836L30QDBVRQ1 has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
To ensure proper power-up and power-down of the TPS3836L30QDBVRQ1, follow the recommended power-up sequence: VDD, then VIO, and finally EN. During power-down, reverse this sequence. Additionally, ensure that the input voltage ramps up and down slowly to prevent damage to the device.
To minimize EMI and EMC issues with the TPS3836L30QDBVRQ1, use a solid ground plane, keep the device and bypass capacitors close together, and use a shielded cable for the output. Additionally, consider adding EMI filters or ferrite beads to the input and output lines.
TPS3836L30QDBVRQ1 datasheet
by Texas Instruments
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