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    Part Img TPS3707-30DGN datasheet by Texas Instruments

    • Processor Supervisory Circuits with Power-Fail 8-MSOP-PowerPAD -40 to 85
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    TPS3707-30DGN datasheet preview

    TPS3707-30DGN Frequently Asked Questions (FAQs)

    • The recommended layout for the TPS3707-30DGN involves placing the device close to the power source, using short and wide traces for the power lines, and keeping the sense lines away from the power lines to minimize noise. Additionally, a 0.1uF ceramic capacitor should be placed between the VCC and GND pins as close to the device as possible.
    • The values of R1 and R2 depend on the desired threshold voltage and hysteresis. A higher R1 value increases the threshold voltage, while a higher R2 value increases the hysteresis. The datasheet provides a formula to calculate the threshold voltage and hysteresis based on the R1 and R2 values. Typically, R1 is in the range of 1kΩ to 10kΩ, and R2 is in the range of 10kΩ to 100kΩ.
    • The maximum voltage that can be applied to the input pins (VIN and VSENSE) is 18V. Exceeding this voltage can damage the device. It's recommended to add voltage limiting components, such as a voltage divider or a zener diode, to ensure that the input voltage does not exceed the maximum rating.
    • During power-up, the TPS3707-30DGN has a built-in power-on reset (POR) circuit that ensures the output is in a high-impedance state until the internal voltage reaches a minimum threshold. During power-down, the output is also in a high-impedance state. The device can tolerate slow power-up and power-down sequences, but rapid changes in the input voltage can cause the device to malfunction.
    • The TPS3707-30DGN is rated for operation up to 125°C. However, the device's accuracy and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider using thermal management techniques, such as heat sinks or thermal interfaces, to ensure reliable operation in high-temperature applications.
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