Texas Instruments recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A minimum of 2 oz copper thickness is recommended for the top layer.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and avoiding thermal hotspots. Additionally, consider derating the device's power dissipation at high temperatures.
The maximum allowed voltage on the EN (enable) pin is 6 V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a resistor divider network to ensure the EN pin voltage remains within the specified range.
While the TPS3600D25PW is designed for high-current applications, it's essential to ensure the device is properly heat-sunk and the PCB is designed to handle high currents. Additionally, consider the device's power dissipation and thermal limitations to avoid overheating.
To troubleshoot issues with the TPS3600D25PW, start by verifying the input voltage, output voltage, and enable pin voltage. Check for proper PCB layout, thermal design, and component selection. Use oscilloscopes and thermal imaging tools to identify potential issues. Consult the datasheet and application notes for guidance.
TPS3600D25PW datasheet
by Texas Instruments
