The recommended layout and placement for the TPS3511DR involves placing the device close to the power source, using a solid ground plane, and keeping the input and output capacitors close to the device. Additionally, it is recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To optimize the performance of the TPS3511DR, ensure that the input voltage is within the recommended range, use a suitable output capacitor, and minimize the distance between the device and the output capacitor. Additionally, use a low-ESR output capacitor and ensure that the PCB layout is optimized for low noise and low impedance.
The TPS3511DR has a thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To ensure reliable operation, ensure that the device is mounted on a PCB with a thermal pad, and that the PCB is designed to dissipate heat effectively. Additionally, ensure that the device is not exposed to high ambient temperatures.
To troubleshoot issues with the TPS3511DR, start by checking the input voltage and ensuring that it is within the recommended range. Check the output voltage and ensure that it is within the expected range. Check for any signs of overheating, and ensure that the device is properly soldered to the PCB. Use an oscilloscope to check for any noise or oscillations on the output.
To minimize EMI with the TPS3511DR, ensure that the device is placed in a shielded area, and that the PCB is designed to minimize radiation. Use a common-mode choke or a ferrite bead to filter the output, and ensure that the output capacitor is placed close to the device. Additionally, use a shielded cable for the output.
TPS3511DR datasheet
by Texas Instruments
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