A good PCB layout for the TPS2391DGKR involves placing the device close to the load, using a solid ground plane, and keeping the high-current paths short and wide. Additionally, it's recommended to use a common-mode choke and a shielded cable to minimize EMI.
To ensure proper thermal management, it's recommended to attach a heat sink to the device, use a thermal interface material, and ensure good airflow around the device. The thermal pad of the device should be connected to a solid ground plane to help dissipate heat.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input of the TPS2391DGKR. The capacitor should be placed close to the device and connected between the VIN and GND pins.
The current limit of the TPS2391DGKR can be adjusted by connecting a resistor between the ILIM pin and the GND pin. The value of the resistor determines the current limit, with a lower resistance value resulting in a higher current limit.
The EN (enable) pin is used to turn the device on and off. When the EN pin is high, the device is enabled and operates normally. When the EN pin is low, the device is disabled and the output is turned off.
TPS2391DGKR datasheet
by Texas Instruments
