A good PCB layout for the TPS22913BYZVT involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure proper power-up and power-down of the TPS22913BYZVT, it's recommended to follow a controlled power-up sequence, where the input voltage is applied before the enable signal. During power-down, the enable signal should be turned off before the input voltage is removed. This helps prevent unwanted current surges and ensures a clean shutdown.
The TPS22913BYZVT has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. Additionally, the device should be mounted on a PCB with a thermal relief pattern to help dissipate heat. It's also recommended to keep the device away from other heat sources on the PCB.
The TPS22913BYZVT has a built-in overcurrent protection feature that limits the output current to a safe level. However, it's still important to design the system to prevent overcurrent conditions from occurring in the first place. This can be done by selecting the correct output capacitor value and ensuring that the input voltage is within the recommended range.
To minimize EMI with the TPS22913BYZVT, it's recommended to use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke to filter the output. Additionally, the PCB layout should be designed to minimize radiated emissions and conducted noise.
TPS22913BYZVT datasheet
by Texas Instruments
