A good PCB layout for the TPA6205A1DGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
The gain setting depends on the input signal level and the desired output power. A higher gain setting can provide more output power, but may also increase noise and distortion. TI provides a gain calculation formula in the datasheet to help determine the optimal gain setting.
The maximum power dissipation of the TPA6205A1DGN is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a thermal derating curve in the datasheet to help determine the maximum power dissipation for a given application.
To filter out noise and EMI, use a combination of passive components such as capacitors, inductors, and resistors to filter the input and output signals. Additionally, use shielding and grounding techniques to minimize electromagnetic interference.
TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins of the device. This helps to filter out noise and ripple on the power supply.
TPA6205A1DGN datasheet
by Texas Instruments
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