A good thermal design should include a solid ground plane, thermal vias under the device, and a heat sink if possible. Refer to the TI application note 'TPA6204A1 PCB Layout Guidelines' for more information.
To ensure stability, use a low-ESR capacitor for decoupling, keep the input and output traces short and symmetrical, and avoid using long wires or cables. Also, make sure the gain-setting resistors are close to the device.
Use a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, both placed as close as possible to the device's power pins. This will help filter out noise and ensure stable operation.
Use a TVS (transient voltage suppressor) diode or a zener diode to clamp the voltage, and consider adding ESD protection devices such as diodes or resistors in series with the input signals.
The maximum power dissipation is dependent on the ambient temperature and the thermal resistance of the PCB. Refer to the datasheet for the power dissipation vs. temperature graph and calculate the maximum power dissipation for your specific application.
TPA6204A1DRB datasheet
by Texas Instruments
