TPA6111A2DGN datasheet by Texas Instruments

TPA6111A2DGN Frequently Asked Questions (FAQs)

• What is the recommended power supply decoupling for the TPA6111A2DGN?
  According to TI's application notes, a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor is recommended for power supply decoupling, placed as close to the device as possible.
• How do I optimize the PCB layout for the TPA6111A2DGN?
  TI recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, the power supply traces should be routed away from the input and output traces to minimize noise coupling.
• What is the maximum power dissipation of the TPA6111A2DGN?
  The maximum power dissipation of the TPA6111A2DGN is 2.5W, and it is recommended to keep the junction temperature below 150°C to ensure reliable operation.
• Can I use the TPA6111A2DGN in a bridged configuration?
  Yes, the TPA6111A2DGN can be used in a bridged configuration, but it requires additional external components and careful PCB layout to ensure proper operation and to minimize distortion.
• How do I protect the TPA6111A2DGN from ESD and overvoltage?
  TI recommends using external ESD protection devices, such as TVS diodes, and overvoltage protection circuits to protect the device from voltage transients and ESD events.