Texas Instruments provides a recommended PCB layout for the TPA3004D2PHPRG4 in the application note SLVAU62, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
The input capacitor values depend on the input voltage, frequency, and desired ripple current. TI provides a capacitor selection guide in the TPA3004 datasheet, which includes a formula to calculate the minimum capacitance required. Additionally, the TI Power Stage Designer tool can be used to simulate and optimize the input capacitor selection.
The maximum allowed voltage on the bootstrap pin (VBST) during startup is 6.5V. Exceeding this voltage can damage the internal bootstrap diode. It's essential to ensure that the bootstrap capacitor is properly sized and the startup sequence is designed to prevent excessive voltage on the VBST pin.
To troubleshoot oscillations or instability, start by checking the PCB layout for any signs of parasitic inductance or capacitance. Ensure that the input and output capacitors are properly decoupled, and the feedback network is correctly implemented. Use an oscilloscope to measure the output voltage and current, and check for any signs of ringing or oscillation. TI also provides a troubleshooting guide in the TPA3004 datasheet, which includes a checklist of common issues and solutions.
The TPA3004 has a built-in thermal shutdown feature that activates when the junction temperature exceeds 150°C. To monitor the temperature, use an external thermistor or thermal sensor connected to the THERM pin. TI recommends using a thermistor with a 10kΩ resistance at 25°C, and a thermal shutdown threshold of 125°C to 135°C to ensure reliable operation.
TPA3004D2PHPRG4 datasheet
by Texas Instruments
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