Texas Instruments provides a recommended PCB layout in the TPA3004D2PHP evaluation module documentation, which includes a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
To ensure stability, follow the recommended component values and PCB layout in the datasheet, and make sure to decouple the power supply with a 10uF capacitor. Additionally, use a low-ESR capacitor for the output filter and avoid using a capacitor with a high Q factor.
The maximum power dissipation of the TPA3004D2PHP is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 10W at 25°C ambient temperature, but this can be derated to 5W at 85°C ambient temperature.
Yes, the TPA3004D2PHP can be used in a bridged configuration to increase the output power. However, this requires careful consideration of the power supply, output filter, and thermal management to ensure reliable operation.
The recommended input impedance for the TPA3004D2PHP is 10kΩ to 20kΩ. This ensures that the input stage is properly biased and that the amplifier operates within its specified parameters.