According to TI's application notes, a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed close to the power pins, are recommended for power supply decoupling.
The gain setting depends on the input signal level and the desired output power. TI provides a gain calculation formula in the datasheet. Additionally, the TPA2013D1RGPR evaluation module can be used to experiment with different gain settings.
The maximum power dissipation of the TPA2013D1RGPR is dependent on the ambient temperature and the thermal resistance of the PCB. TI provides a power dissipation calculation formula in the datasheet. Typically, the maximum power dissipation is around 2.5W.
To protect the TPA2013D1RGPR from overheating, ensure good thermal design practices, such as using a heat sink, keeping the device away from heat sources, and providing adequate airflow. Additionally, the thermal shutdown feature can be used to prevent damage from overheating.
TI provides a recommended PCB layout in the datasheet, which includes keeping the power supply traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device.
TPA2013D1RGPR datasheet
by Texas Instruments
