Texas Instruments provides a recommended PCB layout in the TPA2012D2 application note (SLVAU73). It suggests using a 4-layer PCB with a solid ground plane, placing the device near the edge of the board, and using thermal vias to dissipate heat.
To prevent oscillation and noise, ensure proper decoupling of the power supply, use a low-ESR capacitor (e.g., 10uF) between PVCC and GND, and add a 100nF capacitor between the output and GND. Also, keep the input and output traces short and away from each other.
The maximum power dissipation of the TPA2012D2 is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 2.5W at 25°C ambient temperature. However, this can be derated to 1.5W at 85°C ambient temperature.
Yes, the TPA2012D2 can be used as a stereo amplifier by using two devices, one for each channel. However, it's essential to ensure that the power supply and ground connections are properly decoupled and isolated between the two channels to prevent crosstalk and noise.
The recommended input capacitor value is 10uF to 22uF, and it should be a low-ESR, X7R or X5R type ceramic capacitor. This capacitor helps to filter out high-frequency noise and ensures stable operation.
TPA2012D2RTJTG4 datasheet
by Texas Instruments
