STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 4.5V to 5.5V.
The TN1605H-6FP has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Use an ESD wrist strap, mat, or workstation, and ensure that the device is stored in an ESD-protected package.
The recommended power-up sequence is to apply the power supply voltage (VCC) before applying any input signals. This ensures that the internal circuitry is properly initialized and configured before receiving input signals.
TN1605H-6FP datasheet
by STMicroelectronics
