TMSC6701GJC16719V datasheet by Texas Instruments

TMSC6701GJC16719V Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to improve heat dissipation.
• How do I ensure reliable operation across the entire operating temperature range?
  Ensure that the device is properly decoupled, and that the power supply is stable and well-regulated. Also, follow the recommended operating conditions and thermal management guidelines.
• What are the implications of operating the device at the maximum junction temperature?
  Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. It's recommended to operate the device at a temperature at least 10°C below the maximum rating to ensure optimal performance and reliability.
• How do I troubleshoot issues related to power-on reset and brown-out detection?
  Check the power supply voltage, ensure that the POR and BOR thresholds are set correctly, and verify that the reset and brown-out detection circuits are functioning correctly.
• What are the considerations for EMI and RFI mitigation in the system design?
  Use proper shielding, grounding, and filtering techniques to minimize EMI and RFI. Ensure that the device is placed in a shielded enclosure, and that all cables and connectors are properly shielded and filtered.