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    Part Img TMS5700332APZQQ1 datasheet by Texas Instruments

    • TMS5700332 - 16/32-Bit RISC Flash Microcontroller 100-LQFP -40 to 125
    • Original
    • Yes
    • Yes
    • Obsolete
    • 8542.31.00.01
    • 8542.31.00.00
    • Find it at Findchips.com

    TMS5700332APZQQ1 datasheet preview

    TMS5700332APZQQ1 Frequently Asked Questions (FAQs)

    • The recommended oscillator crystal frequency for the TMS5700332APZQQ1 is 16 MHz or 20 MHz, depending on the specific application and clock speed requirements.
    • To configure the flash memory for optimal performance and endurance, it is recommended to use the Flash API provided by Texas Instruments, which includes functions for programming, erasing, and verifying the flash memory. Additionally, it is important to follow the guidelines for flash memory usage and wear leveling to ensure optimal performance and endurance.
    • The power consumption characteristics of the TMS5700332APZQQ1 vary depending on the operating frequency, voltage, and mode of operation. According to the datasheet, the typical active power consumption is around 250 mA at 1.2 V and 200 MHz, while the typical sleep power consumption is around 10 μA at 1.2 V. However, it is recommended to consult the datasheet and application notes for more detailed information on power consumption and power management.
    • The TMS5700332APZQQ1 has built-in features to support functional safety and security, such as error correction code (ECC) for flash and RAM, redundant clock domains, and a hardware security module (HSM). To implement functional safety and security features, it is recommended to consult the datasheet, application notes, and safety manuals provided by Texas Instruments, and to follow industry standards and guidelines for safety and security, such as IEC 61508 and ISO 26262.
    • The TMS5700332APZQQ1 has a maximum junction temperature of 150°C, and it is recommended to ensure that the device is operated within the specified temperature range to prevent overheating and ensure reliable operation. Thermal management considerations include providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
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