Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow additional guidelines for optimal thermal performance. Ensure a solid ground plane, use thermal vias, and keep the device away from heat sources. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
The TMS55166-60DGH requires a high current supply, especially during startup. Ensure your power supply can provide the necessary current, and consider using a bulk capacitor (e.g., 10uF) close to the device to filter out noise and reduce inrush current. You may also need to add a current-limiting resistor or a soft-start circuit to prevent excessive inrush current.
The TMS55166-60DGH has a high power dissipation, which can lead to thermal issues if not properly addressed. Ensure good airflow, use a heat sink if necessary, and consider using a thermal interface material (TIM) to improve heat transfer. You may also need to derate the device's performance or use a lower power version if thermal constraints are a concern.
To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, and consider using a heat sink or a thermal interface material (TIM) to improve heat transfer. You may also need to derate the device's performance or use a lower power version if thermal constraints are a concern. Additionally, ensure that your system design can handle the device's thermal shutdown feature, which activates when the junction temperature exceeds 150°C.
To minimize EMI and RFI, follow proper PCB layout practices, such as keeping signal traces short, using shielding, and avoiding parallel signal traces. Use a common-mode choke or a ferrite bead to filter out high-frequency noise, and consider using a shielded enclosure or a metal can to reduce radiation. Additionally, ensure that your system design meets the relevant EMI and RFI standards and regulations.
TMS55166-60DGH datasheet
by Texas Instruments
Findchips
Findchips