Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to the bottom layer to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and airflow management. Additionally, consider derating the device's power dissipation and voltage ratings according to the operating temperature.
The internal voltage regulator has a limited current capability (typically 50 mA) and may not be suitable for powering external loads. It's recommended to use an external voltage regulator for powering external components or high-current loads.
To troubleshoot the POR circuitry, verify that the power supply voltage is within the recommended range, and the VCC pin is properly decoupled. Check for any noise or glitches on the power supply lines, and ensure that the POR pin is not being driven by an external signal.
For high-reliability or safety-critical applications, consider using redundant systems, implementing error detection and correction mechanisms, and following relevant industry standards (e.g., IEC 61508 or DO-254). Additionally, perform thorough testing and validation to ensure the device meets the required safety and reliability standards.
