TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the power traces.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and adequate airflow. Additionally, consider derating the device's power dissipation and operating frequency at elevated temperatures.
The critical timing parameters for the clock input include a clock frequency range of 10-40 MHz, a clock rise time of 2-10 ns, and a clock fall time of 2-10 ns. Additionally, the clock duty cycle should be between 40% and 60% to ensure proper operation.
A reliable POR circuit can be implemented using an external voltage supervisor IC, such as the TLV7031, which provides a reset signal to the TMS38054FNL during power-up and power-down sequences. The POR circuit should be designed to ensure a minimum reset pulse width of 10 ms.
To protect the TMS38054FNL from electrostatic discharge (ESD), TI recommends using ESD protection diodes, such as the TVS0501, on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage.
TMS38054FNL datasheet
by Texas Instruments
