The recommended power-on sequence is to apply VDDA (analog power) first, followed by VDD (digital power) and then the clock signal. This ensures proper power-up and minimizes the risk of latch-up or damage to the device.
To optimize performance, consider the following: use the highest possible clock frequency, optimize code for the C55x DSP architecture, use the EDMA (Enhanced Direct Memory Access) controller to offload data transfers, and minimize memory accesses by using the on-chip RAM and cache.
The TMS320VC5509AGHH has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal interface material to maintain a safe operating temperature.
To ensure EMC, follow proper PCB design guidelines, use a multi-layer PCB with a solid ground plane, decouple power supplies, and use shielding and filtering to minimize electromagnetic radiation and susceptibility.
For harsh environments, consider the device's operating temperature range (-40°C to 85°C), ensure proper thermal management, and use conformal coating or potting to protect the device from moisture and contaminants.
TMS320VC5509AGHH datasheet
by Texas Instruments
