TMS320DM6467CCUTAV datasheet by Texas Instruments

TMS320DM6467CCUTAV Frequently Asked Questions (FAQs)

• What is the recommended power-up sequence for the DM6467?
  The recommended power-up sequence is to apply power to the core voltage (VDD_CORE) first, followed by the I/O voltage (VDD_I/O). This ensures that the internal voltage regulators are powered up correctly.
• How do I configure the EMIF (External Memory Interface) for optimal performance?
  To configure the EMIF for optimal performance, ensure that the memory timing parameters (e.g., CAS latency, RAS-to-CAS delay) are set correctly, and the memory clock frequency is within the recommended range (133 MHz to 166 MHz).
• What is the maximum frequency for the DDR2 memory interface?
  The maximum frequency for the DDR2 memory interface is 333 MHz.
• How do I implement a reliable boot process for the DM6467?
  Implement a reliable boot process by using a boot loader that can handle errors and exceptions, and ensure that the boot process is synchronized with the clock domain crossing (CDC) signals.
• What is the recommended thermal design for the DM6467?
  The recommended thermal design involves using a heat sink with a thermal interface material (TIM) to dissipate heat, and ensuring good airflow around the device.