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    Part Img TMS320C6727BGDH300 datasheet by Texas Instruments

    • Floating-Point Digital Signal Processor 256-BGA
    • Original
    • No
    • Yes
    • Active
    • 3A991.A.2
    • 8542.31.00.01
    • Find it at Findchips.com

    TMS320C6727BGDH300 datasheet preview

    TMS320C6727BGDH300 Frequently Asked Questions (FAQs)

    • The recommended power-up sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
    • To configure the EMIF for optimal performance, ensure that the memory timing parameters (e.g., CAS latency, RAS-to-CAS delay) are set according to the memory device's datasheet. Additionally, adjust the EMIF clock frequency and phase to match the memory device's requirements.
    • The maximum clock frequency supported by the TMS320C6727BGDH300 is 350 MHz. However, the actual clock frequency may be limited by the specific application, PCB design, and environmental conditions.
    • To implement a reliable boot process, use a boot loader that can recover from errors and ensure data integrity. Implement a checksum or CRC check on the boot loader and application code to detect any corruption. Additionally, use a secure boot mechanism, such as encryption and authentication, to prevent unauthorized access.
    • To ensure proper thermal management, ensure good airflow around the device, use a heat sink or thermal interface material, and avoid blocking the thermal pads on the package. Monitor the device's temperature using the on-chip temperature sensor and take corrective action if the temperature exceeds the recommended operating range.
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