STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
Use a heat sink or thermal interface material to reduce thermal resistance, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4°C/s or slower.
Use ESD-protective packaging, wrist straps, and mats during handling and assembly. Ensure that the device is not exposed to electrostatic discharge during storage or transportation.
Store the devices in their original packaging, in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the devices to temperatures above 30°C or humidity above 60%.
